Manufacturer: Aitech

Aitech’s E112 forced air-cooled VME computer enclosure is built to be rugged and reliable as well as lightweight and compact. EMI/RFI protected and environmentally sealed, the E112 is capable of withstanding extreme environmental conditions of altitude, temperature, moisture, shock, vibration, EMI and chemical exposure. This makes it ideal for use in all military environments.


The E112 is constructed of durable CNC machined 6061-T6 aluminium. Fasteners are stainless steel and often-used threads have self-locking stainless steel helicoils to withstand severe vibration and shock. All connectors are
located on the front panel of the enclosure for easy access. Sidewalls are internally finned for forced air-cooling without sacrificing ruggedness. Designed with a built-in handle, the E112 is also equipped with hooks and mounting holes to facilitate installation in standard ATR mounting trays.


The E112 accommodates 9 standard VME boards with 0.8-inch pitch, including: 

  • IEEE 1101.2 conduction-cooled VME cards
  • Commercial VME boards without front panels


The backplane assembly is a multilayer printed circuit board, supporting A32/D32 connectivity in accordance with ANSI/IEEE 1014-1987. DC input power is routed to the power supply via a separate screened harness so as to prevent EMI.

96-pin J1 and J2 board connectors meet VMEbus standards. Rows A and C of the J2 connectors are routed to front panel connectors to support I/O functions.

Backplane options include protection transzorbs on each I/O line and P0 connectors (95 I/O pins each) on three slots (1, 4 & 7).


GeneralRugged Chassis for Mobile Military Applications
Designed for Harsh Mechanical, Climatic, Chemical and Electrical Stresses
Environmentally Sealed
Compact and Lightweight with 9 Standard VME Slots
Internally Conduction-Cooled; Externally Forced Air-Cooled
Fully Sealed Faraday Cage and Complete EMI/RFI Power Line Filtering
Customized Front Panel Connectors
Multi-Output Removable Power Supply
CapacityThe E112 accommodates 9 standard VME boards with 0.8 inch pitch, including:
• IEEE 1101.2 conduction-cooled VME cards
• Commercial VME boards without front panels
BackplaneThe backplane assembly is a multilayer printed circuit board, supporting A32/D32 connectivity in accordance with ANSI/IEEE 1014-1987.
PSUVoltage Range (DC): 18 V to 33 V
Nominal Input Voltage: 24 V to 28V
Transient Suppression: Meets requirements of:
– MIL-STD-1275AT (except ignition, cranking and single fault conditions)
– MIL-STD-704D
Output: +5v @ 50A, +12V @ 2A, -12V @ 2A
Total Output Power: 300 W
Efficiency: >75%
CoolingThe E112 is cooled by forced air blown from the rear end of the enclosure to two side heat exchangers. The air can be supplied either by an integral fan unit or an external forced air source. (Reversed air direction is optional.)
IP/NMEAThe E112 is sealed against humidity and splash. Enclosure mating surfaces are sealed with hollow silicon rubber O-ring seals. Connectors and other accessories are protected in the same manner.


ExpansionVME64 compliant
ElectricalSee above for PSU specification
Power Dissipation Capability: More than 150W at 71C forced air temperature (maximum delta T of 20C at card edge).
MechanicalStandard full-ATR short mounting footprint: 10.13 x 12.52 in (W x D)
Maximum external dimensions with fan unit and handle: 10.63 x 15.15 x 7.7 in (W x D x H)
TemperatureOperating Temp: -40C to +71C
Humidity5%-95% relative humidity with condensation
WeightLess than 25 lbs (without boards)
VibrationSine* Cycling of 4.2 g (max)at 5 to 500 Hz
Random* 7.6 g RMS at 20 to 2000 Hz
Transportation Loose cargo vibration
* Hard mounted
ShockSingle half-sine shocks**: 30 g peak, 3 axes, 11 ms duration
** Hard mounted
EMCMeets emanation and susceptibility limits (MIL-STD-461B, part IV, class A3 as per MIL-STD-462 requirements CE102, CS101, CS114, & RE102)
Warranty1 Year
Recab UK
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