- Rugged Chassis for Mobile Military Applications
- Two standard VME64x slots
- Compact and Lightweight VME enclosure
- Environmentally Sealed
- Internally conduction cooled/external air cooled
- MIL-C-38999 or better front connectors
- Complete EMI/RFI Filtering
- Up to -55C to +71C operating range
CONVECTION-COOLED RUGGED DUAL VME SLOT COMPUTER ENCLOSURE
Aitech's E119 Dual Slot VME computer enclosure is built to be rugged and reliable as well as very lightweight and compact. EMI/RFI protected and environmentally sealed, the E119 is capable of withstanding extreme environmental conditions of altitude, temperature, humidity, shock, vibration, EMI and chemical exposure. This makes it ideal for use in all military environments and especially in airborne applications.
STURDY MECHANICAL DESIGN
The E119 is constructed of durable CNC machined 6061-T6 aluminium. Fasteners are stainless steel and often-used threads have self-locking stainless steel helicoils to withstand severe vibration and shock. All connectors are located on one side of the enclosure for easy access. Sides and top walls are externally finned for radiation and convection cooling. The bottom plate is smooth and flat for additional conduction cooling when a cold plate is available. Mounting of the enclosure can be done in 2 ways: By built-in hard mounting features or by additional vibration isolators.
VME BACKPLANE AND BOARD CAPACITY
The E119 accommodates two standard IEEE 1101.2, 6U conduction-cooled VME64x cards. The backplane supports the VME64x bus, including 5-row, 160-pin P1 & P2 connectors, and a 95-pin P0 in both slots.
Any of the 410 pins in rows A and C, user-defined pins in rows Z and D of the P2 connectors, and the I/O pins from each of the two P0 connectors can be routed to the front panel I/O connectors.
The backplane is equipped with DIN41612 I/O connectors, designed for a detachable crimp type wire harness, to connect I/O signals between the backplane and front panel I/O connectors, using harnessing internal to the chassis.