Aitech U-C8770

SOSA™ aligned, up to 32 GB (ECC) DDR3L RAM, XMC Slot

Manufacturer: Aitech
Aitech U-C8770
Introduction

Aligned with The Open Group Sensor Open Systems Architecture™ (SOSA™), the U-C8770 3U VPX SBC is an adaptation of Aitech’s high performance, rugged C877 SBC, and retains the same key technical features and benefits, including proprietary, hardware-based cybersecurity features.  It is ideal for I/O-intensive data processing applications in the military and aerospace markets, such as RADAR, signal intelligence (SIGINT), electronic warfare (EW) and sensor signal processing.

CPU

CPU SpecXeon D-1577 – 16 cores/32 threads (Hyper-Threading) @ 1.3 GHz, 2.1 GHz Turbo Boost, 24 MB Cache
Xeon D-1559 – 12 cores/24 threads (Hyper-Threading) @ 1.5 GHz, 2.1 GHz Turbo Boost, 18 MB Cache
Pentium D-1519 – 4 cores/8 threads (Hyper-Threading), @ 1.5 GHz, 2.1 GHz Turbo Boost, 6 MB Cache
ChipsetIntegrated in CPU
MemoryUp to 32 GB of DDR4 SDRAM in dual channels with ECC operating at 2133 MT/s
DisplayNo onboard graphics
Network2x 1000Base-BX/KX / 10GBase-KR
1 or 2x 1000Base-T, depending on variant
Storage1x SATA Gen2/Gen3
Up to 1 TB on-board SATA SSD, SLC & MLC Flash options with AES 256 Encryption, Quick Erase, and Secure Erase
USB1x USB 3.0/2.0
1x USB 2.0
Serial2x RS-232/422/485
OtherGPIO: 4x Single-Ended / 2x Differential
Xilinx UltraScale+ FPGA: Optional Xilinx Zynq UltraScale+ FPGA w/ARM CPU, linked to the Xeon CPU via PCIe x8 Gen3, enables the implementation of 40GE data plane, I/O customizations and on-board security features.
PlatformSecure Boot based on Intel TXT, TPM 2.0
Trusted Platform with SmartFusion™ Security Manager
BIOS Modification Protection
Boot Guard

GENERAL

ExpansionThe following SOSATM slot profiles are supported by standard configurations of the U-C8770:
• SLT3-PAY-1F1F2U1TU1T1U1T-14.2.16 3U I/O Intensive SBC PICP
Supports all 4 associated module profiles (Dash Num options) of MOD3-PAY-1F1F2U1TU1T1U1T-16.2.15-n
• PCIe data/expansion plane supports up to Gen2 or Gen3, depending on the CPU option selected
• Ethernet data plane support uses the optional Xilinx UltraScale+ FPGA (it must be installed). An FPGA IP core for 10GE/40GE Ethernet support can be provided upon customer request
• Support for DisplayPort interface requires a compatible add-on graphics XMC

XMC I/O Pattern (per VITA 46.9): P1w9-X12d+X16s+X8d
PCIe x8 Gen3 port supporting x8/x4/x2/x1 port widths and Gen3/Gen2/Gen1 speeds (depending on XMC capabilities), 12V VPWR
Electrical26 to 52W maximum (depends on CPU variant)
MechanicalAir-cooled: 3U VPX REDI per ANSI/VITA 48.1
Conduction-cooled 2LM: 3U VPX REDI 2LM (Two-Level Maintenance) per ANSI/VITA 48.2
Conformal CoatingAs standard on all but commercial version Acrylic (Silicone or Urethane are Optional)
SoftwareWindows®, WindRiver VxWorks®, and Linux® are supported
TemperatureAir-Cooled Commercial
• Temperature range (operation): 0 to +55C
• Temperature range (storage): -40 to +85C

Air-Cooled Rugged
• Temperature range (operation): -40 to +70C
• Temperature range (storage): -55 to +125C

Air-Cooled Military
• Temperature range (operation): -40 to +85C
• Temperature range (storage): -55 to +125C

Conduction-Cooled Rugged
• Temperature range (operation): -40 to +70C
• Temperature range (storage): -50 to +100C

Conduction-Cooled Military
• Temperature range (operation): -40 to +85C
• Temperature range (storage): -55 to +125C

Ruggedisation level is determined in the part numbering scheme - refer to datasheet for further details
HumidityCommercial: 0-90%
Rugged/Military: 0 - 95% with Acrylic (Standard), 0 - 100% with Urethane Conformal Coating (Optional)
WeightAir-cooled: < 800 g [1.77 lbs.]
Conduction-cooled 2LM: < 1130 g [2.49 lbs.]
AltitudeCommercial: 15,000ft
Rugged: 35,000ft
Military: 70,000ft
VibrationAir-Cooled Commercial: V1
Air-Cooled Rugged/Military: V2
Conduction-Cooled Rugged/Military: V3
ShockAir-Cooled: OS1
Conduction-Cooled: OS2
Warranty1 Year
RoHSCompliant

 

ORDERING DETAILS

BoardRefer to datasheet for ordering information
Accessories: U-TM8770 Rear Transition Module (RTM) providing convenient access to U-C8770 I/O interfaces via standard connectors and to all XMC I/O via headers. Supports both air and conduction-cooled U-C8770 when installed in a compatible system
Recab UK
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