- COM HPC Server Size E
- Intel® Xeon® D processor series (code name "Ice Lake")
- Industrial Use Condition with extended Temperature options
- 48 PCIe Express lanes
- AI Capabilities with Intel® DL boost
- Real-Time Capable Platform
- Supporting up to 1 TB DDR4 2933MT/s Memory
- 0 to 60°C operation
Speeds to 3.2GHz , Up To 128GB DDR5 Memory, SATA RAID, 4k Display support
The congatec conga-HPC/sILH, a COM-HPC Server size E module, features the brand-new Intel Xeon D processor family, formerly codenamed Ice Lake D. The new COM-HPC Server module in Size E will accelerate the next generation of real-time microserver workloads in rugged environments and extended temperature ranges. Improvements include up to 20 cores, RAM to up to 1 TB, double throughput per PCIe lanes to Gen 4 speed, as well as up to 100 GbE connectivity and TCC/TSN support. Target applications range from industrial workload consolidation servers for automation, robotics and medical backend imaging to outdoor servers for utilities and critical infrastructures – such as smart grids for oil, gas and electricity as well as rail and communication networks – and also includes vision-enabled applications such as autonomous vehicles and video infrastructures for safety and security.
The conga-HPC/sILH COM-HPC Server Size E modules are available with 5 different Intel Xeon D-2700 processors with a choice of 4 to 20 cores, 8 DIMM sockets for up to 1 TByte of 2933 MT/s fast DDR4 memory with ECC, 32x PCIe Gen 4 and 16x PCIe Gen 3 as well as 100 GbE throughput plus real-time capable 2.5 Gbit/s Ethernet with TSN and TCC support at a processor base power of 65 to 118 Watt.