congatec conga-TS170 COM Express basic 6th Gen Type 6

congatec conga-TS170 COM Express basic 6th Gen Type 6 block diagram

Key Features

COM Express® basic 6th Gen Intel® Core CPU
Up to 3.0GHz (quad) versions
Up to 32GB DDR4 memory
1x PCIe x16, 8x PCIe x1
COM.0 Pin-out Type 6
0 to 60°C operation

Congatec conga-TS170

Speeds to 2.8GHz (Quad Core), Up To 32GB DDR4 Memory, SATA RAID, 4k Display support

Manufacturer: congatec

Introduction

The Congatec conga-TS170 is a type 6 COM Express Basic module featuring the sixth generation Intel® Core™ processor. It's available with a wide range of processors, from a dual-core i3 up to a quad-core i7 CPU. The board is also available with a range of Intel® Xeon ® processors. The board has dual DDR4 SODIMM memory sockets supporting up to a maximum of 32GB of DDR4 memory. Standard onboard features include Intel® i219-LM GbE LAN Controller with AMT 11 support, 4 SATA III interfaces, four USB 3.0 channels, eight USB 2.0 channels, one PCIe x16 Gen 3 l interface and eight PCIe Gen3 lanes.

Software support includes support for Microsoft Windows 10, Windows 8.1, Windows 7, WES7 and Linux.

CPU
CPU Spec	Intel® Core™ i7-6820EQ (4 x 2.8 / 3.5 GHz, 8MB cache, 45 W) Intel® Core™ i7-6822EQ (4 x 2.0 / 2.8 GHz, 8MB cache, 25 W) Intel® Core™ i5-6440EQ (4 x 2.7 / 3.4 GHz, 6MB cache, 45 W) Intel® Core™ i5-6442EQ (4 x 1.9 / 2.7 GHz, 6MB cache, 25 W) Intel® Core™ i3-6100E (2 x 2.7 GHz, 3MB cache, 35 W) Intel® Core™ i3-6102E (2 x 1.9 GHz, 3MB cache, 25 W) Intel® Xeon™ E3-1505M V5 (4 x 2.8 / 3.7 GHz, 8MB cache, 45 W) Intel® Xeon™ E3-1505L V5 (4 x 2.0 / 2.8 GHz, 8MB cache, 25 W) Intel® Xeon® E3-1515MV5 (4 x 2,8GHz / 3.7GHz, 8MB cache, 35 W) Intel® Xeon® E3-1578L V5 (4 x 2.0 GHz / 3.4 GHz , 8MB cache, 45 W) Intel® Xeon® E3-1558LV5 (4 x 1.9GHz / 3.3GHz, 8MB cache, 45 W) Intel® Celeron® G3900E 2 x 2.4 GHz, 2MB cache, 35W)
Chipset	Mobile Intel® 100 Series Chipset
Memory	2 Sockets, SO-DIMM DDR4 up to 2400 MT/s and 32GByte dual channel, optionally with ECC support
Graphics	Intel® Gen9 HD Graphics Engine with OpenCL 2.0, OpenGL 4.3 and DirectX12 (for Windows 10) support Up to three independent displays: • HDMI 1.4a • DisplayPort 1.2 • eDP 1.3 High performance hardware MPEG-2 decoding WMV9 (VC-1) and H.265 (HEVC) support Blu-ray support @ 40 MBit/s HEVC, VP8, VP9 and VDENC encoding LVDS (eDP optional): • Dual channel LVDS transmitter, Supports flat panels 2x24 Bit interface • VESA and openLDI colour mappings • Resolutions up to 1920x1200 • Automatic Panel Detection via EDID/EPI Digital Display Interface (DDI) • 3x TMDS (HDMI) / DisplayPort 1.2 with support for Multi-Stream Transport (MST) • Resolutions up to 4k • VGA (optional)
Network	Intel® i219-LM GbE LAN Controller with AMT 11 support
Storage	4x SATA 6Gb/s
USB	4 x USB 3.0 (XHCI) 8 x USB 2.0 (XHCI)
Serial	2x serial interface (RX/TX only)
Audio	Digital High Definition Audio Interface with support for multiple audio codecs
Common	Multi Stage Watchdog Non-volatile User Data Storage Manufacturing and Board Information Board Statistics BIOS Setup Data Backup Power Loss Control I²C bus (fast mode, 400 kHz, multi-master)
BIOS	AMI AptioV® UEFI 2.x firmware 8/16 MByte serial SPI firmware flash
Options	The conga-TS170 can be optionally equipped with a discrete ”Trusted Platform Module” (TPM 1.2 / 2.0)
Power Management	ACPI 4.0 with battery support

GENERAL
Expansion	8x PCI Express™ gen. 3.0 lanes 1x PEG x16 Gen 3
Electrical	12V DC ± 5% Refer to manual for detailed power consumption figures
Mechanical	125 x 95 mm
Conformal Coating	On request
Software	Microsoft® Windows 10 Microsoft® Windows 8.1 Microsoft® Windows 7 Linux \| Microsoft® Windows embedded Standard
Temperature	Operation (standard): 0 to 60°C Non-operation: -20 to 80deg;C
Humidity	Operating: 10 - 90% r. H. non-cond Storage: 5 - 95% r. H. non-cond
Warranty	2 Years
RoHS	Compliant

ORDERING DETAILS
Board	045900 conga-TS170/i7-6820EQ COM Express Type 6 Basic module with Intel® Core™ i7-6820EQ quad-core processor with 2.8GHz up to 3.5GHz, 8MB L2 cache, GT2 graphics and 2133MT/s dual-channel DDR4 memory interface, Chipset QM170 045901 conga-TS170/i7-6822EQ COM Express Type 6 Basic module with Intel® Core™ i7-6822EQ quad-core processor with 2.0GHz up to 2.8GHz, 8MB L2 cache, GT2 graphics and 2133MT/s dual-channel DDR4 memory interface, Chipset QM170 045902 conga-TS170/i5-6440EQ COM Express Type 6 Basic module with Intel® Core™ i5-6440EQ quad-core processor with 2.7GHz up to 3.4GHz, 6MB L2 cache, GT2 graphics and 2133MT/s dual-channel DDR4 memory interface, Chipset QM170 045903 conga-TS170/i5-6442EQ COM Express Type 6 Basic module with Intel® Core™ i5-6442EQ quad-core processor with 1.9GHz up to 2.7GHz, 6MB L2 cache, GT2 graphics and 2133MT/s dual-channel DDR4 memory interface, Chipset QM170 045904 conga-TS170/i3-6100E COM Express Type 6 Basic module with Intel® Core™ i3-6100E dual-core processor with 2.7GHz, 3MB L2 cache, GT2 graphics and 2133MT/s dual-channel DDR4 memory interface, Chipset HM170 045905 conga-TS170/i3-6102E COM Express Type 6 Basic module with Intel® Core™ i3-6102EQ dual-core processor with 1.9GHz, 3MB L2 cache, GT2 graphics and 2133MT/s dual-channel DDR4 memory interface, Chipset HM170 045906 conga-TS170/E3-1505MV5 COM Express Type 6 Basic module with Intel® Xeon® E3-1505M V5 quad-core processor with 2.8GHz up to 3.7GHz, 8MB L2 cache, GT2 graphics and 2133MT/s dual-channel DDR4 memory interface, Chipset CM236 with ECC memory support 045907 conga-TS170/E3-1505LV5 COM Express Type 6 Basic module with Intel® Xeon® E3-1505L V5 quad-core processor with 2.0GHz up to 2.8GHz, 8MB L2 cache, GT2 graphics and 2133MT/s dual-channel DDR4 memory interface, Chipset CM236 with ECC memory support 045908 conga-TS170/i3-6100E ECC COM Express Type 6 Basic module with Intel® Core™ i3-6100E dual-core processor with 2.7GHz, 3MB L2 cache, GT2 graphics and 2133MT/s dual-channel DDR4 memory interface, Chipset CM236 with ECC memory support 045909 conga-TS170/i3-6102E ECC COM Express Type 6 Basic module with Intel® Core™ i3-6102EQ dual-core processor with 1.9GHz, 3MB L2 cache, GT2 graphics and 2133MT/s dual-channel DDR4 memory interface, Chipset CM236 with ECC memory support 045910 conga-TS170/G3900E COM Express Type 6 Basic module with Skylake-H Intel® Celeron® G3900E dual-core processor with 2.4GHz, 2MB L2 cache, GT1 graphics and 2133MT/s dual-channel DDR4 memory interface. Chipset HM170 045911 conga-TS170/G3902E COM Express Type 6 Basic module with Skylake-H Intel® Celeron® G3902E dual-core processor with 1.6GHz, 2MB L2 cache, GT1 graphics and 2133MT/s dual-channel DDR4 memory interface. Chipset HM170 045912 conga-TS170/E3-1515MV5 COM Express Type 6 Basic module with Skylake-H Intel® Xeon® E3-1515M V5 quad-core processor with 2.8GHz up to 3.7GHz, 8MB L2 cache, GT4 graphics and 2133MT/s dual-channel DDR4 memory interface, Chipset CM236 with ECC memory support 045913 conga-TS170/E3-1578LV5 COM Express Type 6 Basic module with Skylake-H Intel® Xeon® E3-1578L V5 quad-core processor with 2.0GHz up to 3.4GHz, 8MB L2 cache, GT4 graphics and 2133MT/s dual-channel DDR4 memory interface, Chipset CM236 with ECC memory support 045914 conga-TS170/E3-1558LV5 COM Express Type 6 Basic module with Skylake-H Intel Xeon® E3-1558L V5 quad-core processor with 1.9GHz up to 3.3GHz, 8MB L2 cache, GT3e graphics and 2133MT/s dual-channel DDR4 memory interface, Chipset CM236 with ECC memory support
Accessories	045930 conga-TS170/CSA-HP-B Standard active cooling solution for high-performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins, 21mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm borehole. 045931 conga-TS170/CSA-HP-T Standard active cooling solution for high-performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins, 21mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread. 045932 conga-TS170/CSP-HP-B Standard passive cooling solution for high-performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins and 21mm overall heat sink height. All standoffs are with 2.7mm borehole. 045933 conga-TS170/CSP-HP-T Standard passive cooling solution for high-performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins and 21mm overall heat sink height. All standoffs are M2.5mm thread. 045934 conga-TS170/HSP-HP-B Standard heatspreader for high-performance COM Express modules conga-TS170/TS175 with integrated heat pipes. All standoffs are with 2.7mm borehole. 045935 conga-TS170/HSP-HP-T Standard heatspreader for high-performance COM Express modules conga-TS170/TS175 with integrated heat pipes. All standoffs are M2.5mm thread. 046450 conga-TS67/HSP-HP-B Standard heatspreader for high-performance COM Express modules conga-TS170, conga-TS67 and TS77 with integrated heat pipes. All standoffs are with 2.7mm borehole 046451 conga-TS67/HSP-HP-T Standard heatspreader for high-performance COM Express modules conga-TS170, conga-TS67 and TS77 with integrated heat pipes. All standoffs are M2.5mm thread 065800 conga-TEVAL Evaluation Carrier Board for COM Express Type 6 Modules. 068790 DDR4-SODIMM-2400 (4GB) DDR4 SODIMM memory module with 2400 MT/s and 4GB RAM 068791 DDR4-SODIMM-2400 (8GB) DDR4 SODIMM memory module with 2400 MT/s and 8GB RAM 068792 DDR4-SODIMM-2400 (16GB) DDR4 SODIMM memory module with 2400 MT/s and 16GB RAM 068795 DDR4-SODIMM-2400 ECC (4GB) DDR4 ECC SODIMM memory module with 2400 MT/s and 4GB RAM 068796 DDR4-SODIMM-2400 ECC (8GB) DDR4 ECC SODIMM memory module with 2400 MT/s and 8GB RAM 068797 DDR4-SODIMM-2400 ECC (16GB) DDR4 ECC SODIMM memory module with 2400 MT/s and 16GB RAM

Key Features

Congatec conga-TS170

Speeds to 2.8GHz (Quad Core), Up To 32GB DDR4 Memory, SATA RAID, 4k Display support

Introduction

CPU

GENERAL

ORDERING DETAILS

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