Congatec conga-TS170

Speeds to 2.8GHz (Quad Core), Up To 32GB DDR4 Memory, SATA RAID, 4k Display support

Manufacturer: congatec
Congatec conga-TS170
Introduction

The Congatec conga-TS170 is a type 6 COM Express Basic module featuring the sixth generation Intel® Core™ processor. It's available with a wide range of processors, from a dual-core i3 up to a quad-core i7 CPU. The board is also available with a range of Intel® Xeon ® processors. The board has dual DDR4 SODIMM memory sockets supporting up to a maximum of 32GB of DDR4 memory. Standard onboard features include Intel® i219-LM GbE LAN Controller with AMT 11 support, 4 SATA III interfaces, four USB 3.0 channels, eight USB 2.0 channels, one PCIe x16 Gen 3 l interface and eight PCIe Gen3 lanes.

Software support includes support for Microsoft Windows 10, Windows 8.1, Windows 7, WES7 and Linux.

 

 

Intel® Celeron® G3902E 2 x 1.6 GHz, 2MB cache, 25W)

CPU

CPU SpecIntel® Core™ i7-6820EQ (4 x 2.8 / 3.5 GHz, 8MB cache, 45 W)
Intel® Core™ i7-6822EQ (4 x 2.0 / 2.8 GHz, 8MB cache, 25 W)
Intel® Core™ i5-6440EQ (4 x 2.7 / 3.4 GHz, 6MB cache, 45 W)
Intel® Core™ i5-6442EQ (4 x 1.9 / 2.7 GHz, 6MB cache, 25 W)
Intel® Core™ i3-6100E (2 x 2.7 GHz, 3MB cache, 35 W)
Intel® Core™ i3-6102E (2 x 1.9 GHz, 3MB cache, 25 W)
Intel® Xeon™ E3-1505M V5 (4 x 2.8 / 3.7 GHz, 8MB cache, 45 W)
Intel® Xeon™ E3-1505L V5 (4 x 2.0 / 2.8 GHz, 8MB cache, 25 W)
Intel® Xeon® E3-1515MV5 (4 x 2,8GHz / 3.7GHz, 8MB cache, 35 W)
Intel® Xeon® E3-1578L V5 (4 x 2.0 GHz / 3.4 GHz , 8MB cache, 45 W)
Intel® Xeon® E3-1558LV5 (4 x 1.9GHz / 3.3GHz, 8MB cache, 45 W)
Intel® Celeron® G3900E 2 x 2.4 GHz, 2MB cache, 35W)
ChipsetMobile Intel® 100 Series Chipset
Memory2 Sockets, SO-DIMM DDR4 up to 2400 MT/s and 32GByte dual channel, optionally with ECC support
GraphicsIntel® Gen9 HD Graphics Engine with OpenCL 2.0, OpenGL 4.3 and DirectX12 (for Windows 10) support
Up to three independent displays:
• HDMI 1.4a
• DisplayPort 1.2
• eDP 1.3
High performance hardware MPEG-2 decoding
WMV9 (VC-1) and H.265 (HEVC) support
Blu-ray support @ 40 MBit/s
HEVC, VP8, VP9 and VDENC encoding
LVDS (eDP optional):
• Dual channel LVDS transmitter, Supports flat panels 2x24 Bit interface
• VESA and openLDI colour mappings
• Resolutions up to 1920x1200
• Automatic Panel Detection via EDID/EPI
Digital Display Interface (DDI)
• 3x TMDS (HDMI) / DisplayPort 1.2 with support for Multi-Stream Transport (MST)
• Resolutions up to 4k
• VGA (optional)
NetworkIntel® i219-LM GbE LAN Controller with AMT 11 support
Storage4x SATA 6Gb/s
USB4 x USB 3.0 (XHCI)
8 x USB 2.0 (XHCI)
Serial2x serial interface (RX/TX only)
AudioDigital High Definition Audio Interface with support for multiple audio codecs
CommonMulti Stage Watchdog
Non-volatile User Data Storage
Manufacturing and Board Information
Board Statistics
BIOS Setup Data Backup
Power Loss Control
I²C bus (fast mode, 400 kHz, multi-master)
BIOSAMI AptioV® UEFI 2.x firmware
8/16 MByte serial SPI firmware flash
OptionsThe conga-TS170 can be optionally equipped with a discrete ”Trusted Platform Module” (TPM 1.2 / 2.0)
Power ManagementACPI 4.0 with battery support

GENERAL

Expansion8x PCI Express™ gen. 3.0 lanes
1x PEG x16 Gen 3
Electrical12V DC ± 5%
Refer to manual for detailed power consumption figures
Mechanical125 x 95 mm
Conformal CoatingOn request
SoftwareMicrosoft® Windows 10
Microsoft® Windows 8.1
Microsoft® Windows 7
Linux |
Microsoft® Windows embedded Standard
TemperatureOperation (standard): 0 to 60°C
Non-operation: -20 to 80deg;C
HumidityOperating: 10 - 90% r. H. non-cond
Storage: 5 - 95% r. H. non-cond
Warranty2 Years
RoHSCompliant

 

ORDERING DETAILS

Board045900
conga-TS170/i7-6820EQ
COM Express Type 6 Basic module with Intel® Core™ i7-6820EQ quad-core processor with 2.8GHz up to 3.5GHz, 8MB L2 cache, GT2 graphics and 2133MT/s dual-channel DDR4 memory interface, Chipset QM170

045901
conga-TS170/i7-6822EQ
COM Express Type 6 Basic module with Intel® Core™ i7-6822EQ quad-core processor with 2.0GHz up to 2.8GHz, 8MB L2 cache, GT2 graphics and 2133MT/s dual-channel DDR4 memory interface, Chipset QM170

045902
conga-TS170/i5-6440EQ
COM Express Type 6 Basic module with Intel® Core™ i5-6440EQ quad-core processor with 2.7GHz up to 3.4GHz, 6MB L2 cache, GT2 graphics and 2133MT/s dual-channel DDR4 memory interface, Chipset QM170

045903
conga-TS170/i5-6442EQ
COM Express Type 6 Basic module with Intel® Core™ i5-6442EQ quad-core processor with 1.9GHz up to 2.7GHz, 6MB L2 cache, GT2 graphics and 2133MT/s dual-channel DDR4 memory interface, Chipset QM170

045904
conga-TS170/i3-6100E
COM Express Type 6 Basic module with Intel® Core™ i3-6100E dual-core processor with 2.7GHz, 3MB L2 cache, GT2 graphics and 2133MT/s dual-channel DDR4 memory interface, Chipset HM170

045905
conga-TS170/i3-6102E
COM Express Type 6 Basic module with Intel® Core™ i3-6102EQ dual-core processor with 1.9GHz, 3MB L2 cache, GT2 graphics and 2133MT/s dual-channel DDR4 memory interface, Chipset HM170

045906
conga-TS170/E3-1505MV5
COM Express Type 6 Basic module with Intel® Xeon® E3-1505M V5 quad-core processor with 2.8GHz up to 3.7GHz, 8MB L2 cache, GT2 graphics and 2133MT/s dual-channel DDR4 memory interface, Chipset CM236 with ECC memory support

045907
conga-TS170/E3-1505LV5
COM Express Type 6 Basic module with Intel® Xeon® E3-1505L V5 quad-core processor with 2.0GHz up to 2.8GHz, 8MB L2 cache, GT2 graphics and 2133MT/s dual-channel DDR4 memory interface, Chipset CM236 with ECC memory support

045908
conga-TS170/i3-6100E ECC
COM Express Type 6 Basic module with Intel® Core™ i3-6100E dual-core processor with 2.7GHz, 3MB L2 cache, GT2 graphics and 2133MT/s dual-channel DDR4 memory interface, Chipset CM236 with ECC memory support

045909
conga-TS170/i3-6102E ECC
COM Express Type 6 Basic module with Intel® Core™ i3-6102EQ dual-core processor with 1.9GHz, 3MB L2 cache, GT2 graphics and 2133MT/s dual-channel DDR4 memory interface, Chipset CM236 with ECC memory support

045910
conga-TS170/G3900E
COM Express Type 6 Basic module with Skylake-H Intel® Celeron® G3900E dual-core processor with 2.4GHz, 2MB L2 cache, GT1 graphics and 2133MT/s dual-channel DDR4 memory interface. Chipset HM170

045911
conga-TS170/G3902E
COM Express Type 6 Basic module with Skylake-H Intel® Celeron® G3902E dual-core processor with 1.6GHz, 2MB L2 cache, GT1 graphics and 2133MT/s dual-channel DDR4 memory interface. Chipset HM170

045912
conga-TS170/E3-1515MV5
COM Express Type 6 Basic module with Skylake-H Intel® Xeon® E3-1515M V5 quad-core processor with 2.8GHz up to 3.7GHz, 8MB L2 cache, GT4 graphics and 2133MT/s dual-channel DDR4 memory interface, Chipset CM236 with ECC memory support

045913
conga-TS170/E3-1578LV5
COM Express Type 6 Basic module with Skylake-H Intel® Xeon® E3-1578L V5 quad-core processor with 2.0GHz up to 3.4GHz, 8MB L2 cache, GT4 graphics and 2133MT/s dual-channel DDR4 memory interface, Chipset CM236 with ECC memory support

045914
conga-TS170/E3-1558LV5
COM Express Type 6 Basic module with Skylake-H Intel Xeon® E3-1558L V5 quad-core processor with 1.9GHz up to 3.3GHz, 8MB L2 cache, GT3e graphics and 2133MT/s dual-channel DDR4 memory interface, Chipset CM236 with ECC memory support
Accessories045930
conga-TS170/CSA-HP-B
Standard active cooling solution for high-performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins, 21mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm borehole.

045931
conga-TS170/CSA-HP-T
Standard active cooling solution for high-performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins, 21mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.

045932
conga-TS170/CSP-HP-B
Standard passive cooling solution for high-performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins and 21mm overall heat sink height. All standoffs are with 2.7mm borehole.

045933
conga-TS170/CSP-HP-T
Standard passive cooling solution for high-performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins and 21mm overall heat sink height. All standoffs are M2.5mm thread.

045934
conga-TS170/HSP-HP-B
Standard heatspreader for high-performance COM Express modules conga-TS170/TS175 with integrated heat pipes. All standoffs are with 2.7mm borehole.

045935
conga-TS170/HSP-HP-T
Standard heatspreader for high-performance COM Express modules conga-TS170/TS175 with integrated heat pipes. All standoffs are M2.5mm thread.

046450
conga-TS67/HSP-HP-B Standard heatspreader for high-performance COM Express modules conga-TS170, conga-TS67 and TS77 with integrated heat pipes. All standoffs are with 2.7mm borehole

046451
conga-TS67/HSP-HP-T Standard heatspreader for high-performance COM Express modules conga-TS170, conga-TS67 and TS77 with integrated heat pipes. All standoffs are M2.5mm thread

065800
conga-TEVAL
Evaluation Carrier Board for COM Express Type 6 Modules.

068790 DDR4-SODIMM-2400 (4GB) DDR4 SODIMM memory module with 2400 MT/s and 4GB RAM
068791 DDR4-SODIMM-2400 (8GB) DDR4 SODIMM memory module with 2400 MT/s and 8GB RAM
068792 DDR4-SODIMM-2400 (16GB) DDR4 SODIMM memory module with 2400 MT/s and 16GB RAM

068795 DDR4-SODIMM-2400 ECC (4GB) DDR4 ECC SODIMM memory module with 2400 MT/s and 4GB RAM
068796 DDR4-SODIMM-2400 ECC (8GB) DDR4 ECC SODIMM memory module with 2400 MT/s and 8GB RAM
068797 DDR4-SODIMM-2400 ECC (16GB) DDR4 ECC SODIMM memory module with 2400 MT/s and 16GB RAM
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