Kontron COMe-bID7

Speeds to 2.20GHz, up to 16 cores, up to 128GB DDR4 Memory, Dual SATA RAID, quad 10GbE

Manufacturer: Kontron
Kontron COMe-bID7
Introduction

The COMe-bID7 (E2) with scalability from 4 to 10 cores on a small form factor and SKUs for industrial temperature range of -40°C up to +85° as well as 24x7 / 10 years reliability allows robust, space-constraint implementations in harsh environments and extreme conditions.

The module accommodates up to 4x SO-DIMM sockets for a max. of 128GB memory. As storage medium, a soldered NVMe SSD onboard with up to 1 TByte storage capacity is optionally available.

16x PCIe Gen4 plus 16x PCIe Gen3 lanes and 4x 10GBASE-KR interfaces provide an ideal support for high data throughput requirements in demanding I/O and network structures.

The 10GBASE-KR design allows for maximum flexibility by defining the physical interface – KR for backplane connectivity, Copper (RJ45) or fibre (SFP+) - on the base board.

CPU

CPU Spec
Intel® Xeon® D-1749NT, 90W, 10 core, 3.0GHz
Intel® Xeon® D-1735R, 59W, 8 core, 2.2GHz
Intel® Xeon® D-1718T, 46W, 4 core, 2.6GHz
Intel® Xeon® D-1747NTE, 80W, 10 core, 2.5GHz, ind. temp.
Intel® Xeon® D-1746TER, 67/56W, 10 core, 2.0GHz, ind. temp.
Intel® Xeon® D-1732TE, 52W, 8 core, 1.9GHz, ind. temp.
Intel® Xeon® D-1715TER, 50W, 4 core, 2.4GHz, ind. temp.
See the complete list in COMe-bID7 datasheet
ChipsetIntegrated into CPU
Memory2x DDR4 SODIMM for up to 64 GByte ECC / non ECC
on request: 4x DDR4 SODIMM for up to 128 GByte ECC / non ECC
GraphicsNo onboard graphics
Network1x 1/2.5 Gb (1/2.5 GBASE-T) - Intel® I225LM/IT
4x 10Gb (10 GBASE-KR) - Intel® Quad 10GbE LAN integrated in SoC
StorageUp to 2x SATA3, 6Gb/s
Up to 1 TByte NVMe SSD (on request)
USB4x USB 3.0 (4x USB 2.0)
Serial2x serial interface (RX/TX only)
CommonSPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC
OptionsNVMe SSD, additional 3rd and 4th SODIMM socket
BIOSAMI UEFI
Power ManagementACPI 6.0
PlatformTPM 2.0

General

Expansion16x PCIe Gen4 (1 x16, 2 x8, 4 x4)
16x PCIe Gen3 (2 x8, 4 x4, 8 x2)
COM Express® Basic, Pin-out Type 7
Electrical8.5 V – 20 V Wide Range, Single Supply Power
Mechanical125 x 95 mm
SoftwareLinux, Windows® Server 2012/2016
TemperatureOperation (standard): 0 to 60°C
Operation (industrial): -40 to 85°C
Non-operation:(standard): -30 to 85deg;C
Non-operation:(industrial): -40 to 85deg;C
Humidity93 % relative Humidity at 40° C, non-condensing (according to IEC 60068-2-78)
Warranty2 Years
RoHSCompliant

 

Ordering Details

Board68009-0000-46-1
COMe-bID7 E2 D-1746TER
COM Express® basic pin-out type 7 COM.0 R3.1 with Intel® D-1746TER, 67/56W, 10 core, 2.0GHz, 4x 10GBASE-KR, 16x PCIe Gen4, 16x PCIe Gen3, 2x DDR4 SO-DIMM socket, industrial temperature

68009-0000-47-2
COMe-bID7 E2 D-1747NTE
COM Express® basic pin-out type 7 COM.0 R3.1 with Intel® D-1747NTE, 80W, 10 core, 2.5GHz, 4x 10GBASE-KR, 16x PCIe Gen4, 16x PCIe Gen3, 2x DDR4 SO-DIMM socket, industrial temperature

68009-0000-32-1
COMe-bID7 E2 D-1732TE
COM Express® basic pin-out type 7 COM.0 R3.1 with Intel® D-1732TE, 52W, 8 core, 1.9GHz, 4x 10GBASE-KR, 16x PCIe Gen4, 16x PCIe Gen3, 2x DDR4 SO-DIMM socket, industrial temperature

68009-0000-15-1
COMe-bID7 E2 D-1715TER
COM Express® basic pin-out type 7 COM.0 R3.1 with Intel® D-1715TER, 50W, 4 core, 2.4GHz, 4x 10GBASE-KR, 16x PCIe Gen4, 16x PCIe Gen3, 2x DDR4 SO-DIMM socket, industrial temperature

68008-0000-49-2
COMe-bID7 D-1749NT
COM Express® basic pin-out type 7 COM.0 R3.1 with Intel®D-1749NT, 90W, 10 core, 3.0GHz, 4x 10GBASE-KR, 16x PCIe Gen4, 16x PCIe Gen3, 2x DDR4 SO-DIMM socket

68008-0000-35-1
COMe-bID7 D-1735TR
COM Express® basic pin-out type 7 COM.0 R3.1 with Intel® D-1735R, 59W, 8 core, 2.2GHz, 4x 10GBASE-KR, 4x 10GBASE-KR, 16x PCIe Gen4, 16x PCIe Gen3, 2x DDR4 SO-DIMM socket

68008-0000-18-1
COMe-bID7 D-1718T
COM Express® basic pin-out type 7 COM.0 R3.1 with Intel® D-1718T, 46W, 4 core, 2.6GHz, 4x 10GBASE-KR, 16x PCIe Gen4, 16x PCIe Gen3, 2x DDR4 SO-DIMM socket
Accessories68009-0000-99-0 HSP COMe-bID7 (E2) THREAD Heatspreader for COMe-bID7 commercial and E2, threaded mounting holes
68009-0000-99-1 HSP COMe-bDV7 (E2) THROUGH Heatspreader for COMe-bID7 commercial and E2, through holes

38025-0000-99-0C05 HSK COMe-basic active (w/o HSP) Active Cooler for COMe-bxL6/bDV7/bID7 to be mounted on HSP
38025-0000-99-0C06 HSK COMe-basic passive (w/o HSP) Passive Cooler for COMe-bxL6/bDV7/bID7 to be mounted on HSP

97030-0832-BID7 DDR4-3200 SODIMM 8GB ECC_BID7 DDR4-3200, 8GB, 260P, 1600MHz, PC4-3200 SODIMM, ECC
97030-1632-BID7 DDR4-3200 SODIMM 16GB ECC_BID7 DDR4-3200, 16GB, 260P, 1600MHz, PC4-3200 SODIMM, ECC
97030-3232-BID7 DDR4-3200 SODIMM 32GB ECC_BID7 DDR4-3200, 32GB, 260P, 1600MHz, PC4-3200 SODIMM, ECC

97031-0832-BID7 DDR4-3200 SODIMM 8GB ECC E2_BID7 DDR4-3200, 8GB, 260P, 1600MHz, PC4-3200 SODIMM, ECC, -40°C to + 85°C
97031-1632-BID7 DDR4-3200 SODIMM 16GB ECC E2_BID7 DDR4-3200, 16GB, 260P, 1600MHz, PC4-3200 SODIMM, ECC, -40°C to + 85°C
97031-3232-BID7 DDR4-3200 SODIMM 32GB ECC E2_BID7 DDR4-3200, 32GB, 260P, 1600MHz, PC4-3200 SODIMM, ECC, -40°C to + 85°C

68301-0001-00-8 COM Express® Eval Carrier Type 7

68301-0000-01-4 Adapter Card with 4x RJ45 ports for use with COM Express® Eval Carrier Type 7 – X557 PHY
68301-0000-04-4 Adapter Card with 4x 10G-KR ports for use with COM Express® Eval Carrier Type 7 - no PHY
68301-0000-05-4 Adapter Card with 4x SFP+ ports for use with COM Express® Eval Carrier Type 7 G2 – C827-IM1 PHY
Need a COM basedboard designed - try us!
Recab UK
Interested in this Product?

Get In Touch