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Kontron COMe-bID7 - COM Express® basic Type 7 with Intel® Xeon® D CPU

Key Features

COM Express® basic Intel® XEON® D-1700 SOC
Up to 3.0GHz CPU with up to 10 cores
Up to 64GB or 128GB DDR4 memory
16x PCIe Gen4 and 16x PCIe Gen3
Quad 10 GbE interfaces
COM.0 Pin-out Type 7
0 to 60°C or - 40 to +85°C operation

Download Kontron COMe-bID7 Datasheet

Download Kontron Tech Specs COM EXPRESS basic

Download COM Express Carrier Design Guide

Download COM Express Technology Paper

Board and heatspreader drawings (PDF or 3D STEP) on request

Kontron COMe-bID7

Speeds to 2.20GHz, up to 16 cores, up to 128GB DDR4 Memory, Dual SATA RAID, quad 10GbE

Manufacturer: Kontron

Introduction

The COMe-bID7 (E2) with scalability from 4 to 10 cores on a small form factor and SKUs for industrial temperature range of -40°C up to +85° as well as 24x7 / 10 years reliability allows robust, space-constraint implementations in harsh environments and extreme conditions.

The module accommodates up to 4x SO-DIMM sockets for a max. of 128GB memory. As storage medium, a soldered NVMe SSD onboard with up to 1 TByte storage capacity is optionally available.

16x PCIe Gen4 plus 16x PCIe Gen3 lanes and 4x 10GBASE-KR interfaces provide an ideal support for high data throughput requirements in demanding I/O and network structures.

The 10GBASE-KR design allows for maximum flexibility by defining the physical interface – KR for backplane connectivity, Copper (RJ45) or fibre (SFP+) - on the base board.

CPU
CPU Spec	Intel® Xeon® D-1749NT, 90W, 10 core, 3.0GHz Intel® Xeon® D-1735R, 59W, 8 core, 2.2GHz Intel® Xeon® D-1718T, 46W, 4 core, 2.6GHz Intel® Xeon® D-1747NTE, 80W, 10 core, 2.5GHz, ind. temp. Intel® Xeon® D-1746TER, 67/56W, 10 core, 2.0GHz, ind. temp. Intel® Xeon® D-1732TE, 52W, 8 core, 1.9GHz, ind. temp. Intel® Xeon® D-1715TER, 50W, 4 core, 2.4GHz, ind. temp. See the complete list in COMe-bID7 datasheet
Chipset	Integrated into CPU
Memory	2x DDR4 SODIMM for up to 64 GByte ECC / non ECC on request: 4x DDR4 SODIMM for up to 128 GByte ECC / non ECC
Graphics	No onboard graphics
Network	1x 1/2.5 Gb (1/2.5 GBASE-T) - Intel® I225LM/IT 4x 10Gb (10 GBASE-KR) - Intel® Quad 10GbE LAN integrated in SoC
Storage	Up to 2x SATA3, 6Gb/s Up to 1 TByte NVMe SSD (on request)
USB	4x USB 3.0 (4x USB 2.0)
Serial	2x serial interface (RX/TX only)
Common	SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC
Options	NVMe SSD, additional 3rd and 4th SODIMM socket
BIOS	AMI UEFI
Power Management	ACPI 6.0
Platform	TPM 2.0

General
Expansion	16x PCIe Gen4 (1 x16, 2 x8, 4 x4) 16x PCIe Gen3 (2 x8, 4 x4, 8 x2) COM Express® Basic, Pin-out Type 7
Electrical	8.5 V – 20 V Wide Range, Single Supply Power
Mechanical	125 x 95 mm
Software	Linux, Windows® Server 2012/2016
Temperature	Operation (standard): 0 to 60°C Operation (industrial): -40 to 85°C Non-operation:(standard): -30 to 85deg;C Non-operation:(industrial): -40 to 85deg;C
Humidity	93 % relative Humidity at 40° C, non-condensing (according to IEC 60068-2-78)
Warranty	2 Years
RoHS	Compliant

Ordering Details
Board	68009-0000-46-1 COMe-bID7 E2 D-1746TER COM Express® basic pin-out type 7 COM.0 R3.1 with Intel® D-1746TER, 67/56W, 10 core, 2.0GHz, 4x 10GBASE-KR, 16x PCIe Gen4, 16x PCIe Gen3, 2x DDR4 SO-DIMM socket, industrial temperature 68009-0000-47-2 COMe-bID7 E2 D-1747NTE COM Express® basic pin-out type 7 COM.0 R3.1 with Intel® D-1747NTE, 80W, 10 core, 2.5GHz, 4x 10GBASE-KR, 16x PCIe Gen4, 16x PCIe Gen3, 2x DDR4 SO-DIMM socket, industrial temperature 68009-0000-32-1 COMe-bID7 E2 D-1732TE COM Express® basic pin-out type 7 COM.0 R3.1 with Intel® D-1732TE, 52W, 8 core, 1.9GHz, 4x 10GBASE-KR, 16x PCIe Gen4, 16x PCIe Gen3, 2x DDR4 SO-DIMM socket, industrial temperature 68009-0000-15-1 COMe-bID7 E2 D-1715TER COM Express® basic pin-out type 7 COM.0 R3.1 with Intel® D-1715TER, 50W, 4 core, 2.4GHz, 4x 10GBASE-KR, 16x PCIe Gen4, 16x PCIe Gen3, 2x DDR4 SO-DIMM socket, industrial temperature 68008-0000-49-2 COMe-bID7 D-1749NT COM Express® basic pin-out type 7 COM.0 R3.1 with Intel®D-1749NT, 90W, 10 core, 3.0GHz, 4x 10GBASE-KR, 16x PCIe Gen4, 16x PCIe Gen3, 2x DDR4 SO-DIMM socket 68008-0000-35-1 COMe-bID7 D-1735TR COM Express® basic pin-out type 7 COM.0 R3.1 with Intel® D-1735R, 59W, 8 core, 2.2GHz, 4x 10GBASE-KR, 4x 10GBASE-KR, 16x PCIe Gen4, 16x PCIe Gen3, 2x DDR4 SO-DIMM socket 68008-0000-18-1 COMe-bID7 D-1718T COM Express® basic pin-out type 7 COM.0 R3.1 with Intel® D-1718T, 46W, 4 core, 2.6GHz, 4x 10GBASE-KR, 16x PCIe Gen4, 16x PCIe Gen3, 2x DDR4 SO-DIMM socket
Accessories	68009-0000-99-0 HSP COMe-bID7 (E2) THREAD Heatspreader for COMe-bID7 commercial and E2, threaded mounting holes 68009-0000-99-1 HSP COMe-bDV7 (E2) THROUGH Heatspreader for COMe-bID7 commercial and E2, through holes 38025-0000-99-0C05 HSK COMe-basic active (w/o HSP) Active Cooler for COMe-bxL6/bDV7/bID7 to be mounted on HSP 38025-0000-99-0C06 HSK COMe-basic passive (w/o HSP) Passive Cooler for COMe-bxL6/bDV7/bID7 to be mounted on HSP 97030-0832-BID7 DDR4-3200 SODIMM 8GB ECC_BID7 DDR4-3200, 8GB, 260P, 1600MHz, PC4-3200 SODIMM, ECC 97030-1632-BID7 DDR4-3200 SODIMM 16GB ECC_BID7 DDR4-3200, 16GB, 260P, 1600MHz, PC4-3200 SODIMM, ECC 97030-3232-BID7 DDR4-3200 SODIMM 32GB ECC_BID7 DDR4-3200, 32GB, 260P, 1600MHz, PC4-3200 SODIMM, ECC 97031-0832-BID7 DDR4-3200 SODIMM 8GB ECC E2_BID7 DDR4-3200, 8GB, 260P, 1600MHz, PC4-3200 SODIMM, ECC, -40°C to + 85°C 97031-1632-BID7 DDR4-3200 SODIMM 16GB ECC E2_BID7 DDR4-3200, 16GB, 260P, 1600MHz, PC4-3200 SODIMM, ECC, -40°C to + 85°C 97031-3232-BID7 DDR4-3200 SODIMM 32GB ECC E2_BID7 DDR4-3200, 32GB, 260P, 1600MHz, PC4-3200 SODIMM, ECC, -40°C to + 85°C 68301-0001-00-8 COM Express® Eval Carrier Type 7 68301-0000-01-4 Adapter Card with 4x RJ45 ports for use with COM Express® Eval Carrier Type 7 – X557 PHY 68301-0000-04-4 Adapter Card with 4x 10G-KR ports for use with COM Express® Eval Carrier Type 7 - no PHY 68301-0000-05-4 Adapter Card with 4x SFP+ ports for use with COM Express® Eval Carrier Type 7 G2 – C827-IM1 PHY

Key Features

Kontron COMe-bID7

Speeds to 2.20GHz, up to 16 cores, up to 128GB DDR4 Memory, Dual SATA RAID, quad 10GbE

Introduction

CPU

General

Ordering Details

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