Introduction

The new conga-TC670 COM Express Basic module is available with a range of different Intel^® Core™ i7, i5, i3 and Celeron processors all with a 45W TDP dissipation. Based on the new low-power high-density Alder Lake SoCs the new modules offer significantly greater CPU performance and nearly 3x higher GPU performanceⁱ along with state-of-the-art PCIe Gen4 and USB4 support

The modules offer all the common I/O interfaces of the Type 6 pinout including 2x SATA 6G ports, quad USB 3.1 gen 2 ports (10gbit/sec) and eight USB 2.0 ports. Further I/O interfaces include 1x 2.5GbE TSN Ethernet via Intel® i225, 8x PCIe Gen3 and PEG support x4 (PCIe Gen4)