Congatec conga-TC670

Compact T6 module with 12th gen Intel Core processors

Manufacturer: congatec
Congatec conga-TC670
Introduction

The new conga-TC670 COM Express Basic module is available with a range of different Intel® Core™ i7, i5, i3 and Celeron processors all with a 45W TDP dissipation. Based on the new low-power high-density Alder Lake SoCs the new modules offer significantly greater CPU performance and nearly 3x higher GPU performanceⁱ along with state-of-the-art PCIe Gen4 and USB4 support

The modules offer all the common I/O interfaces of the Type 6 pinout including 2x SATA 6G ports, quad USB 3.1 gen 2 ports (10gbit/sec) and eight USB 2.0 ports. Further I/O interfaces include 1x 2.5GbE TSN Ethernet via Intel® i225, 8x PCIe Gen3 and PEG support x4 (PCIe Gen4)

CPU

CPU SpecIntel® Core™ i7-12800HE (6 x 2.4 GHz, 24 MB cache, 45W)
Intel® Core™ i5-12600HE (4 x 2.5 GHz, 18 MB cache, 45W)
Intel® Core™ i3-12300HE (4 x 1.9 GHz, 12 MB cache, 45W)
ChipsetIntegrated PCH-LP
MemoryUp to 2 SODIMM sockets for DDR5 memory modules
Up to 32 GByte each (64 GByte total) with 4800 MT/s
ECC and non-ECC supported
Graphics

Intel® UHD Graphics or Intel® Iris® Xe Graphics architecture
Up to 96 EUs
Interfaces: 

  • 3x DDI (up to 5K support)
  • LVDS (optional eDP)
  • VGA (optional)
Network1x 2,5GbE TSN Ethernet via Intel® i225
Storage2 x SATA III (6Gb/s)
USB8 x USB (up to 4x USB 3.2, up to 8x USB 2.0)
Serial2x serial interface (RX/TX only)
AudioHDA
OtherGPIOs
SPI
LPC
SM Bus
I2C
CommonMulti-Stage Watchdog
Non-volatile User Data Storage
Manufacturing and Board Information
Board Statistics I²C bus (fast mode, 400 kHz, multi-master)
Power Loss Control
Hardware Health Monitoring
POST Code redirection
BIOSAMI Aptio® UEFI firmware
SM-BIOS
BIOS Update
Logo Boot
Quiet Boot
HDD Password
Power ManagementACPI 6.0 with battery support
PlatformTrusted Platform Module (TPM 2.0)

General

ExpansionPCIe Gen4 PEG
Up to 8 PCIe Gen3
COM Express® Compact | Type 6 connector pinout
Electrical12V DC ± 5%
Refer to manual for detailed power consumption figures
Mechanical95 x 95 mm
Conformal CoatingOn request
SoftwareMicrosoft® Windows 11
Microsoft® Windows 10
Microsoft® Windows 10 IoT Enterprise
Linux
Yocto
Real Time Systems Hypervisor
TemperatureOperation: 0 to 60°C
Non-operation: -20 to 80deg;C
HumidityOperating: 10 - 90% r. H. non-cond
Storage: 5 - 95% r. H. non-cond
Warranty2 Years
RoHSCompliant

 

Ordering Details

Board

049700
conga-TC670/i7-12800HE
COM Express Type 6 Compact module based on Intel® Core™ i7-12800HE processor with 6 P-cores 2.4GHz up to 4.6GHz and 8 E-cores 1.8GHz up to 3.5GHz | 24MB Intel® Smart Cache | Intel® Iris® Xe Graphics architecture with 96 EUs | Dual-channel DDR5 4800 MT/s memory interface | Intel® code name Alder Lake-P (H-Series)

049703
conga-TC670/i5-12600HE
COM Express Type 6 Compact module based on Intel® Core™ i5-12600HE processor with 4 P-cores 2.5GHz up to 4.5GHz and 8 E-cores 1.8GHz up to 3.3GHz | 18MB Intel® Smart Cache | Intel® Iris® Xe Graphics architecture with 80EUs | Dual-channel DDR5 4800 MT/s memory interface | Intel® code name Alder Lake-P (H-Series)

049706
conga-TC670/i3-12300HE
COM Express Type 6 Compact module based on Intel® Core™ i3-12300HE processor with 4 P-cores 1.9GHz up to 4.3GHz and 4 E-cores 1.5GHz up to 3.3GHz | 12MB Intel® Smart Cache | Intel® UHD Graphics with 48EUs | Dual-channel DDR5 4800 MT/s memory interface | Intel® code name Alder Lake-P (H-Series)

AccessoriesCooling solution information to follow

065810
conga-TEVAL2
Evaluation carrier board for Type 6 Rev 3.0 COM-Express-modules

011115 
conga-LDVI/EPI
LVDS to DVI converter board for digital flat panels with onboard EEPROM COM-Express-carrier-board

400007 
Socket-5
Connector for COM-Express carrier boards, height 5mm, packing unit 4 pieces

400004 
Socket-8
Connector for COM-Express carrier boards, height 8mm, packing unit 4 pieces
Need a COM basedboard designed - try us!
Recab UK
Interested in this Product?

Get In Touch