Congatec conga-TCV2

Speeds to 2.90GHz (8 Cores), Up To 64GB DDR4 Memory, 4K Display support

Manufacturer: congatec
Congatec conga-TCV2
Introduction

The new conga-TCV2 high-performance COM Express Compact modules with Type 6 pinout are based on the latest AMD Ryzen™ Embedded V2000 multi-core processors and will become available in 4 different flavours:

ProcessorCores/ThreadsClock [GHz] (Base/Boost)L2/L3 Cache (MB)GPU Compute UnitsTDP [W]
AMD Ryzen™ Embedded V27488 / 162.9 / 4.154 / 8735 – 54
AMD Ryzen™ Embedded V27188 / 161.7 / 4.154 / 8710 – 25
AMD Ryzen™ Embedded V25466 / 123.0 / 3.953 / 6635 – 54
AMD Ryzen™ Embedded V25166 / 122.1 / 3.953 / 6610 – 25

These modules offer up to double the compute performance per watt and double the core count over previous generations. Thanks to symmetrical multiprocessing capabilities, they also provide particularly high parallel processing performance with up to 16 threads. The modules feature 4MB L2 cache, 8MB L3 cache, and up to 32GB energy-efficient and fast dual-channel 64-bit DDR4 memory with up to 3200 MT/s and ECC support for maximum data security. The integrated AMD Radeon™ graphics with up to 7 compute units continue to support applications and use cases that need high-performance graphics computing.

The conga-TCV2 Computer-on-Module supports up to four independent displays with up to 4k60 UHD resolution over 3x DisplayPort 1.4/HDMI 2.1 and 1x LVDS/eDP. Further performance-oriented interfaces include 1x PEG 3.0 x8 and 8x PCIe Gen 3 Lanes, 2x USB 3.1 Gen 2, 8x USB 2.0, up to 2x SATA Gen 3, 1x Gbit Ethernet, 8 GPIO, SPI, LPC, as well as 2x legacy UART provided by the board controller.

The supported hypervisor and operating systems include RTS Hypervisor as well as Microsoft Windows 10, Linux/Yocto, Android Q and Wind River VxWorks. For safety-critical applications, the integrated AMD Secure Processor helps with hardware-accelerated encryption and decryption of RSA, SHA and AES. TPM support is onboard as wellⁱ.

CPU

CPU SpecAMD Ryzen Embedded V2516 (6 x 2.1 GHz, 3MB L2 cache, 10W)
AMD Ryzen Embedded V2546 (6 x 3 GHz, 3MB L2 cache, 35W)
AMD Ryzen Embedded V2718 (8 x 1.7 GHz, 4MB L2 cache, 10W)
AMD Ryzen Embedded V2748 (8 x 2.9 GHz, 4MB L2 cache, 35W)
ChipsetIntegrated into CPU
MemoryUp to 2 SO-DIMM sockets for DDR4 memory modules up to 32 GByte each (64 GByte total) with 3200 MT/s and ECC support
GraphicsIntegrated Radeon™ graphics engine with up to 7 Compute Units
Supporting 4 independent display units (4x 4K)
DirectX 12 support
VCN2.2 (H.264/AVC HW 8b
H.265/HEVC HW 8/10b
VP9 HW 8/10b)
DP 1.4
3x DP/DP++ | eDP/LVDS
Network1x Gigabit Ethernet via Intel® i225
Storage2x SATA III (6Gb/s)
USB4x USB 3.1 Gen 2
8/4x USB 2.0
Serial2x serial interface (RX/TX only)
AudioHD-Audio over DP++ ports | HDA interface
Other8x GPIO
LPC
CommonMulti-Stage Watchdog
Non-volatile User Data Storage
Manufacturing and Board Information
Board Statistics
I²C bus (fast mode, 400 kHz, multi-master)
Power Loss Control
Hardware Health Monitoring
POST Code redirection
BIOSAMI Aptio® UEFI firmware
16 Mbyte serial SPI with congatec Embedded BIOS feature
OEM Logo
OEM CMOS Defaults
LCD Control
Display Auto Detection
Backlight Control
Flash Update
OptionsN/A
Power ManagementACPI 5.0 with battery support
SecurityTrusted Platform Module (TPM 2.0) | AMD Secure Processor | AMD Memory Guard

General

Expansion5x PCIe Gen3 (8 lanes) | PEG support x8
Electrical12V DC ± 5%
Refer to manual for detailed power consumption figures
Mechanical95 x 95 mm
Conformal CoatingOn request
SoftwareMicrosoft® Windows 10
Microsoft® Windows 10 IoT Enterprise
Ubuntu Linux LTS
RTS Hypervisor
TemperatureOperation (standard): 0 to 60°C
Non-operation: -40 to 85°C
HumidityOperating: 10 - 90% r. H. non-cond
Storage: 5 - 95% r. H. non-cond
Warranty2 Years
RoHSCompliant

 

Ordering Details

Board

050500
conga-TCV2/V2748
COM Express Type 6 Compact module based on AMD Embedded Ryzen V2748 8 core processor with 2.9GHz up to 4.25GHz turbo boost, 4MB L2 cache, Radeon Vega7 Graphics with 7 CU and dual-channel DDR4 3200 MT/s memory interface with ECC support. Commercial temperature range.

050501
conga-TCV2/V2546
COM Express Type 6 Compact module based on AMD Embedded Ryzen V2546 6 core processor with 3.0GHz up to 3.95GHz turbo boost, 3MB L2 cache, Radeon Vega6 Graphics with 6 CU and dual-channel DDR4 3200 MT/s memory interface with ECC support. Commercial temperature range.

050502
conga-TCV2/V2718
COM Express Type 6 Compact module based on AMD Embedded Ryzen V2718 8 core processor with 1.7GHz up to 4.15GHz turbo boost, 4MB L2 cache, Radeon Vega7 Graphics with 7 CU and dual-channel DDR4 3200 MT/s memory interface with ECC support. Commercial temperature range.

050503
conga-TCV2/V2516
COM Express Type 6 Compact module based on AMD Embedded Ryzen V2516 6 core processor with 2.1GHz up to 3.95GHz turbo boost, 3MB L2 cache, Radeon Vega6 Graphics with 6 CU and dual-channel DDR4 3200 MT/s memory interface with ECC support. Commercial temperature range.

Accessories

050550
conga-TCV2/CSA-HP-B
Standard active cooling solution for high-performance COM Express module conga-TCV2 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are with
2.7mm bore hole.

050551
conga-TCV2/CSA-HP-T
Standard active cooling solution for high-performance COM Express module conga-TCV2 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.

050552
conga-TCV2/CSP-HP-B
Standard passive cooling solution for high-performance COM Express module conga-TCV2 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are with 2.7mm bore hole.

050553
conga-TCV2/CSP-HP-T
Standard passive cooling solution for high-performance COM Express module conga-TCV2 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are M2.5mm thread.

050554
conga-TCV2/HSP-HP-B
Standard heatspreader for high-performance COM Express module conga-TCV2 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole.

050555
conga-TCV2/HSP-HP-T
Standard heatspreader for high-performance COM Express module conga-TCV2 with integrated heat pipes, 11mm overall heat sink height. All standoffs are M2.5mm thread.

065810
conga-TEVAL/COMe 3.0
Evaluation carrier board for COM Express Type6 Rev. 3.0 modules.
Need a COM basedboard designed - try us!
Recab UK
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