congatec conga-QMX8-Plus

NXP i.MX 8M Plus 14nm processor series with ARM 4-Core Cortex-A53 / M7 + NPU

Manufacturer: congatec
congatec conga-QMX8-Plus
Introduction

congatec's newest Qseven product is the conga-QMX8-Plus, a brand new Qseven module based on the NXP i.MX 8M Plus application processor. This next-generation processor platform is the perfect upgrade for all NXP i.MX 6 based Qseven applications that have been running in the field for many years. It brings modern machine learning and AI capabilities as well as TSN support for real-time Ethernet to those applications and will extend their lifetime by an additional 10 to 15 years, maximizing the return on investment for such systems.

The powerful new Qseven module is based on the i.MX 8M Plus application processor with 1.8 GHz Arm Cortex-A53 quad-core performance and an additional integrated neural processing unit (NPU) with up to 2.3 TOPS. As the first i.MX processor with a machine learning accelerator, the i.MX 8M Plus provides substantially higher performance for deep learning inference and artificial intelligence at the edge. At a typical ultra-low power consumption of just 3 watts, the new conga-QMX8-Plus module delivers a performance boost of more than 150 %, supported by the 64-bit architecture and onboard LPDDR4 memory with up to 6 GB. Highly energy efficient Arm performance, machine learning capabilities and Ethernet with TSN support enable even more powerful and smarter embedded and IIoT connected edge systems at the edge. Vertical markets for these low power modules range from industrial controls, smart robotics and factory automation to medical health care and retail, and from transportation and smart farming to smart cities and smart buildings.

The feature set of the new Qseven modules in detail

The new conga-QMX8-Plus Qseven modules are equipped with 1.8 GHz Arm Cortex‑A53 quad-core based NXP i.MX 8M Plus processors for the industrial (0°C to +60°C) or 1.6 GHz variants for the extended (-40°C to +85°C) temperature ranges. The modules can control up to three independent displays, connected via natively supported HDMI 2.0a, LVDS 2x24bit and MIPI-DSI, and provide hardware-accelerated video decoding and encoding including H.265 so that high-resolution camera streams delivered by two integrated MIPI-CSI interfaces can be sent directly to the network. For onboard data storage, the modules provide up to 128 GB 5.1 eMMC, which can also operate in safe pSLC mode, as well as 1x onboard µSD socket. Peripheral interfaces include 1x PCIe Gen 3, 1x USB 3.0, 3x USB 2.0, 4x UART as well as 1x CAN FD and 14x GPIO. For real-time networking, the module offers 1x Gbit with TSN support. 2x I2S for sound rounds off the feature set. The supported operating systems include Linux, Yocto and Android.

CPU

CPU SpecNXP i.MX 8M Plus (4, ARM® Cortex®-A53 @1.6GHz +1x ARM® Cortex®-M7 + NPU)
ChipsetIntegrated into SoC
MemoryUp to 6 GByte onboard LPDDR4 memory | 4000 MT/s | inline ECC
GraphicsIntegrated in SoC | GC7000UL 3D graphics with 2 high-performance vec4 shaders
GC520L 2D graphics VPU up to 1080p60 H.265/H.264 decoding and encoding 
OpenGL ES 3.1
Vulcan
OpenCL 1.2 FP
OpenVG 1.1 2 independent displays
Video I/F:1 x dual-channel 24-bit LVDS | 1x HDMI 2.0a | 1x MIPI-DSI 4-lane shared with second LVDS channel
2 x MIPI-CSI 4-lane onboard connectors | 2x integrated Image Signal Processor (ISP) for cameras with up to 12 MP resolution
Network1 x Gbit Ethernet with IEEE 1588 and TSN Support
StorageeMMC 5.1 up to 128 GByte | SPI NOR Flash up to 64MByte
1 x SDIO 3.0
1 x onboard µSD card socket
USB1 x dual-role USB 3.0
3 x USB 2.0
Serial1 x UART with Handshake
AudioI²S
Other2 x I²C bus
1 x SPI
1 x CAN FD
12 x GPIOs
BIOSU-Boot boot loader
SecurityCryptographic Acceleration and Assurance Module (CAAM)
Resource Domain Controller
ARM® TrustZone® High Assurance Boot support
SHE, Encryption Engine AES-128, AES-256, 3DES, RC4, RSA4096, TRNG SHA-1, SHA-2, SHA-256, MD-5
RSA-1024, 2048, 3072, 40

 

General

ExpansionQseven Rev. 2.1
1 x PCIe 3.0
ElectricalTyp application 5 15W @ 5V
Mechanical70 x 70 x 6 mm
SoftwareLinux
Yocto
Android
TemperatureOperation: 0°C to 60°C (commercial grade)
Operation: -40°C to 85°C (industrial grade)
Storage: -40°C to 85°C
HumidityOperation: 10% to 90% (non condensing)
Storage: 5% to 95% (non condensing)
Warranty2 Years
RoHSCompliant

 

Ordering Details

Board

016620
conga-QMX8-Plus/i-QC-NPU-4G eMMC16
Qseven module with low-power 14nm NXP i.MX 8M Plus Quad processor. Features 4x ARM® Cortex®-A53 @ 1.6GHz +1x ARM® Cortex®-M7 + NPU, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Industrial grade temperature range from -40°C to 85°C.

016621
conga-QMX8-Plus/i-QC-NPU-2G eMMC16
Qseven module with low-power 14nm NXP i.MX 8M Plus Quad processor. Features 4x ARM® Cortex®-A53 @ 1.6GHz +1x ARM® Cortex®-M7 + NPU, 2GB onboard LPDDR4 memory and 16GB onboard eMMC. Industrial grade temperature range from -40°C to 85°C.

Accessories

016650
conga-QMX8-Plus/HSP-T
Standard heatspreader for Qseven module conga-QMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are 2.5mm thread.

016651
conga-QMX8-Plus/HSP-B
Standard heatspreader for Qseven module conga-QMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are with 2.7mm bore hole.

48000023
RS232 adapter cable for conga-ARM modules
RS232 adapter cable for congatec ARM modules console debug application. 

44500041
Basler dart camera daA3840-30mc
Basler dart BCON for MIPI camera module daA3840-30mc, 8Mpx, 30fps, 4 CSI2-Lanes, S-Mount.

10000399
FFC Basler dart BCON for MIPI, 200mm
FFC 28 pin cable for Basler BCON dart cameras, 0,5mm pitch. compatible with 28 pin Hirose ZIF connector (PN: FH41-28S-0.5SH(05)

10000429
Evetar Lens M118B0418IR F1.8 f4mm 1/1.8" -Lens
Evetar Lens M118B0418IR F1.8 f4mm 1/1.8" - Lens for Basler dart camera module daA3840-30mc

007005
conga-QEVAL/Qseven 2.0 ARM
Evaluation carrier board for Qseven 2.0 modules based on ARM architecture.

Recab UK
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