Temperature testing is essential for testing PCBs and systems intended for use in an embedded system for extreme environments. The temperature chamber allows system designers to observe the impact of different temperatures on components and system performance, allowing for quick validation of designs that are expected to meet demanding environmental conditions.
For example, military embedded computing systems will need to operate effectively at incredibly low and high temperatures, due to the varied environments that it may be used. To be able to accurately guarantee that a system will function effectively and consistently at a certain operating temperature, the product needs to be tested extensively to demonstrate this.
At Recab UK, we have a temperature chamber on-site to allow for extensive thermal testing of our embedded computing products. This in-house resource means that we can streamline the testing and validation process of our product designs, allowing us to quickly develop solutions for even the most extreme applications.
The temperature chamber allows us to screen or burn-in products prior to shipment to the customer to minimize out of the box failures by ensuring the weaker components that would fail prematurely in the field are detected and replaced before going into service.
Burn-in cycles consist of subjecting the product to the low and high extremes of the intended temperature range of the product. A cycle generally starts at the lower temperature extreme transitioning to the higher temperature extreme and finishing at ambient temperature.
The cycles are repeated over a period ranging from hours to days whilst continual product testing is carried out to detect any failures.
Below are some examples of projects Recab UK has delivered that have involved the use of heat chamber testing.